Hysol eccobond CA3556HF, a silver-filled electrically conductive adhesive, cures fast at low temperatures. The material is suitable for high-throughput production and applications that dictate high peel strength, such as the assembly of photovoltaic modules and membrane switches that incorporate temperature-sensitive substrates. The adhesive is suitable for crystalline-silicon (c-Si) and thin film manufacturing. Other benefits of the adhesive include stress minimization properties to compensate for CTE mismatches and a no-mix, one-part formula that reduces operator error.
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